Method for determining stochastic variation of printed patterns

    公开(公告)号:US11567413B2

    公开(公告)日:2023-01-31

    申请号:US17430517

    申请日:2020-01-30

    IPC分类号: G03F7/20

    摘要: A method for determining measurement data of a printed pattern on a substrate. The method involves obtaining (i) images of the substrate including a printed pattern corresponding to a reference pattern, (ii) an averaged image of the images, and (iii) a composite contour based on the averaged image. Further, the composite contour is aligned with respect to a reference contour of the reference pattern and contours are extracted from the images based on both the aligned composite contour and the output of die-to-database alignment of the composite contour. Further, the method determines a plurality of pattern measurements based on the contours and the measurement data corresponding to the printed patterns based on the plurality of the pattern measurements. Further, the method determines a one or more process variations such as stochastic variation, inter-die variation, intra-die variation and/or total variation.

    Method and apparatus for design of a metrology target
    3.
    发明授权
    Method and apparatus for design of a metrology target 有权
    计量目标设计方法和设备

    公开(公告)号:US09355200B2

    公开(公告)日:2016-05-31

    申请号:US14577820

    申请日:2014-12-19

    IPC分类号: G06F17/50 G03F7/20

    摘要: A method of metrology target design is described. The method includes determining a sensitivity of a parameter for a metrology target design to an optical aberration, determining the parameter for a product design exposed using an optical system of a lithographic apparatus, and determining an impact on the parameter of the metrology target design based on the parameter for the product design and the product of the sensitivity and one or more of the respective aberrations of the optical system.

    摘要翻译: 描述了一种计量目标设计方法。 该方法包括确定用于度量目标设计的参数对光学像差的灵敏度,确定使用光刻设备的光学系统暴露的产品设计的参数,以及基于以下方式确定对度量目标设计的参数的影响: 产品设计的参数和灵敏度的乘积以及光学系统的各个像差中的一个或多个。

    Metrology method and apparatus
    6.
    发明授权

    公开(公告)号:US09903823B2

    公开(公告)日:2018-02-27

    申请号:US14945257

    申请日:2015-11-18

    摘要: A method to determine an overlay error between a first structure and a second structure, wherein the first structure and second structures are on different layers on a substrate and are imaged onto the substrate by a lithographic process, the method comprising: obtaining an apparent overlay error; obtaining a systematic error caused by a factor other than misalignment of the first and second structures; and determining the overlay error by removing the systematic error from the apparent overlay error. The method may alternatively comprise obtaining apparent characteristics of diffraction orders of diffraction by an overlapping portion of the first and second structures; obtaining corrected characteristics of the diffraction orders; determining the overlay error from the corrected characteristics; and adjusting a characteristic of the lithographic process based on the overlay error.

    Selection of substrate measurement recipes

    公开(公告)号:US10983440B2

    公开(公告)日:2021-04-20

    申请号:US16301458

    申请日:2017-05-09

    IPC分类号: G03F7/20

    摘要: A method including: obtaining a relationship between a performance indicator of a substrate measurement recipe and a parameter of the substrate measurement recipe; deriving a range of the parameter from the relationship, wherein absolute values of the performance indicator satisfy a first condition or a magnitude of variation of the performance indicator satisfies a second condition, when the first parameter is in the range; selecting a substrate measurement recipe that has the parameter in the range; and inspecting a substrate with the selected substrate measurement recipe.

    Substrate measurement recipe configuration to improve device matching

    公开(公告)号:US10691029B2

    公开(公告)日:2020-06-23

    申请号:US16305913

    申请日:2017-06-01

    IPC分类号: G03F7/00 G06F30/30 G03F7/20

    摘要: A method including computing a multi-variable cost function, the multi-variable cost function representing a metric characterizing a degree of matching between a result when measuring a metrology target structure using a substrate measurement recipe and a behavior of a pattern of a functional device, the metric being a function of a plurality of design variables including a parameter of the metrology target structure, and adjusting the design variables and computing the cost function with the adjusted design variables, until a certain termination condition is satisfied.