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公开(公告)号:US20250044710A1
公开(公告)日:2025-02-06
申请号:US18714547
申请日:2022-12-13
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiyou FU , Jing SU , Chenxi LIN , Jiao LIANG , Guangqing CHEN , Yi ZOU
Abstract: A method of image template matching for multiple process layers of, for example, semiconductor substrate with an adaptive weight map is described. An image template is provided with a weight map, which is adaptively updated based during template matching based on the position of the image template on the image. A method of template matching a grouped pattern or artifacts in a composed template is described, wherein the pattern comprises deemphasized areas weighted less than the image templates. A method of generating an image template based on a synthetic image is described. The synthetic image can be generated based on process and image modeling. A method of selecting a grouped pattern or artifacts and generating a composed template is described. A method of per layer image template matching is described.
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公开(公告)号:US20220229375A1
公开(公告)日:2022-07-21
申请号:US17610481
申请日:2020-04-28
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiyou FU
Abstract: A method for determining stochastic edge placement error associated with a pattern. The method includes acquiring, via a metrology tool, a plurality of images of the pattern at a defined location on the substrate without performing a substrate alignment therebetween; and generating at least two data: (i) first data associated with the pattern using a first set of images of the plurality of images, and (ii) second data associated with the pattern using a second set of images of the plurality of images. The first set of images and the second set of images include at least one different image. The method further includes determining (e.g., via a decomposition algorithm), using the first data and the second data associated with the pattern at the defined location, the stochastic edge placement error associated with the pattern.
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公开(公告)号:US20230280659A1
公开(公告)日:2023-09-07
申请号:US18138383
申请日:2023-04-24
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiyou FU
CPC classification number: G03F7/70625 , G06T7/001 , G06T2207/10061 , G06T2207/30148
Abstract: A method for determining stochastic edge placement error associated with a pattern. The method includes acquiring, via a metrology tool, a plurality of images of the pattern at a defined location on the substrate without performing a substrate alignment therebetween; and generating at least two data: (i) first data associated with the pattern using a first set of images of the plurality of images, and (ii) second data associated with the pattern using a second set of images of the plurality of images. The first set of images and the second set of images include at least one different image. The method further includes determining (e.g., via a decomposition algorithm), using the first data and the second data associated with the pattern at the defined location, the stochastic edge placement error associated with the pattern.
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