公开(公告)号：US11994845B2

公开(公告)日：2024-05-28

申请号：US17367901

申请日：2021-07-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Sarathi Roy ,  Edo Maria Hulsebos ,  Roy Werkman ,  Junru Ruan

IPC: G05B19/418 ,  G03F7/00 ,  G05B13/02 ,  G06N3/044

CPC classification number: G05B19/41875 ,  G03F7/70508 ,  G03F7/70525 ,  G05B13/027 ,  G05B19/41885 ,  G06N3/044 ,  G05B2219/33025 ,  G05B2219/45028 ,  G05B2219/45031

Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.

公开(公告)号：US11086305B2

公开(公告)日：2021-08-10

申请号：US17174159

申请日：2021-02-11

Applicant: ASML NETHERLANDS B.V.

Inventor： Sarathi Roy ,  Edo Maria Hulsebos ,  Roy Werkman ,  Junru Ruan

IPC: G05B19/418 ,  G05B13/02 ,  G03F7/20 ,  G06N3/04

Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.