公开(公告)号：US20180307145A1

公开(公告)日：2018-10-25

申请号：US15951343

申请日：2018-04-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Everhardus Cornelis MOS ,  Jochem Sebastiaan Wildenberg ,  Marcel Hendrikus Maria Beems ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20

CPC classification number: G03F7/70625 ,  G03F7/705 ,  G03F7/70508 ,  G03F7/70516 ,  G03F7/70616 ,  G03F7/70891

Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.

公开(公告)号：US10527957B2

公开(公告)日：2020-01-07

申请号：US15778517

申请日：2016-10-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Cayetano Sanchez-Fabres Cobaleda ,  Franciscus Godefridus Casper Bijnen ,  Edo Maria Hulsebos ,  Arie Jeffrey Den Boef ,  Marcel Hendrikus Maria Beems ,  Piotr Michał Stolarz

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.

公开(公告)号：US10809631B2

公开(公告)日：2020-10-20

申请号：US15951343

申请日：2018-04-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Everhardus Cornelis Mos ,  Jochem Sebastiaan Wildenberg ,  Marcel Hendrikus Maria Beems ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20

Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.