METHOD AND APPARATUS FOR OPTIMIZATION OF LITHOGRAPHIC PROCESS

    公开(公告)号:US20210349402A1

    公开(公告)日:2021-11-11

    申请号:US17381817

    申请日:2021-07-21

    IPC分类号: G03F7/20 G03F9/00

    摘要: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.

    Method and apparatus for optimization of lithographic process

    公开(公告)号:US11099487B2

    公开(公告)日:2021-08-24

    申请号:US16495416

    申请日:2018-03-28

    IPC分类号: G03F7/20 G03F9/00

    摘要: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.