公开(公告)号：US20210240073A1

公开(公告)日：2021-08-05

申请号：US16972073

申请日：2019-04-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Thomas THEEUWES ,  Koenraad VAN INGEN SCHENAU ,  Pieter Joseph Marie WOLTGENS

IPC: G03F1/70 ,  G03F7/20

Abstract: A method for assigning features into at least first features and second features, the first features being for at least one first patterning device configured for use in a lithographic process to form corresponding first structures on a substrate and the second features being for at least one second patterning device configured for use in a lithographic process to form corresponding second structures on a substrate, wherein the method including assigning the features into the first features and the second features based on a patterning characteristic of the features.