公开(公告)号：US11668661B2

公开(公告)日：2023-06-06

申请号：US17019149

申请日：2020-09-11

Applicant: ASML Netherlands B.V.

Inventor： Thomas Jarik Huisman ,  Sander Frederik Wuister ,  Hermanus Adrianus Dillen ,  Dorothea Maria Christina Oorschot

IPC: G01N23/2251 ,  G06T7/62 ,  G03F1/84 ,  G03F7/20 ,  G06T7/00 ,  G03F7/00

CPC classification number: G01N23/2251 ,  G03F1/84 ,  G03F7/7085 ,  G03F7/70608 ,  G06T7/0004 ,  G06T7/62 ,  G01N2223/07 ,  G01N2223/401 ,  G01N2223/507 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Apparatuses, systems, and methods for inspecting a semiconductor sample are disclosed. In some embodiments, the sample may comprise a structure having a plurality of openings in a top layer of the structure. In some embodiments, the method may comprise generating an image of the structure using a SEM; inspecting an opening of the plurality of openings by determining a dimension of the opening based on the image and determining an open-state of the opening, based on a contrast of the image; and determining a quality of the opening based on both the determined dimension and the determined open-state of the opening.