公开(公告)号：US20250037961A1

公开(公告)日：2025-01-30

申请号：US18714936

申请日：2022-11-02

Applicant: ASML Netherlands B.V.

Inventor： Martin Frans, Pierre SMEETS ,  Niels Johannes, Maria BOSCH ,  Willem Petrus VAN AAKEN ,  Jef GOOSSENS ,  Te-Yu CHEN ,  Funda SAHIN

IPC: H01J37/153 ,  H01J37/147 ,  H01J37/20

Abstract: An improved method and system for correcting inspection image error are disclosed. An improved method comprises acquiring a set of first beam positions on a test wafer while a wafer stage supporting the test wafer moves at a first velocity; acquiring a set of second beam positions, corresponding to the set of first beam positions, on the test wafer while the wafer stage moves at a second velocity; calculating a beam position displacement of a beam while the wafer stage moves at a third velocity in a range of velocities from the first velocity to the second velocity; and adjusting a beam position of the beam based on the calculated beam position displacement.