SYSTEM AND METHOD FOR HIGH THROUGHPUT DEFECT INSPECTION IN A CHARGED PARTICLE SYSTEM

    公开(公告)号:US20230116381A1

    公开(公告)日:2023-04-13

    申请号:US17911121

    申请日:2021-03-09

    Abstract: Apparatuses, systems, and methods for generating a beam for inspecting a wafer positioned on a stage in a charged particle beam system are disclosed. In some embodiments, a controller may include circuitry configured to classify a plurality of regions along a stripe of the wafer by type of region, the stripe being larger than a field of view of the beam, wherein the classification of the plurality of regions includes a first type of region and a second type of region; and scan the wafer by controlling a speed of the stage based on the type of region, wherein the first type of region is scanned at a first speed and the second type of region is scanned at a second speed.

    BEAM ARRAY GEOMETRY OPTIMIZER FOR MULTI-BEAM INSPECTION SYSTEM

    公开(公告)号:US20230086984A1

    公开(公告)日:2023-03-23

    申请号:US17909352

    申请日:2021-02-24

    Abstract: Apparatuses, systems, and methods for beam array geometry optimization of a multi-beam inspection tool are disclosed. In some embodiments, a microelectromechanical system (MEMS) may include a first row of apertures; a second row of apertures positioned below the first row of apertures; a third row of apertures positioned below the second row of apertures; and a fourth row of apertures positioned below the third row of apertures; wherein the first, second, third, and fourth rows are parallel to each other in a first direction; the first and third rows are offset from the second and fourth rows in a second direction that is perpendicular to the first direction; the first and third rows have a first length; the second and fourth rows have a second length; and the first length is longer than the second length in the second direction.

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