公开(公告)号：US20210219457A1

公开(公告)日：2021-07-15

申请号：US17132139

申请日：2020-12-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chun-Chieh WONG ,  Cheng-Yu WANG

IPC: H05K7/20 ,  G06F1/20

Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.

公开(公告)号：US20210066160A1

公开(公告)日：2021-03-04

申请号：US16931560

申请日：2020-07-17

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Chang LEE ,  Chun-Chieh WONG ,  Cheng-Yu WANG ,  Tai-Min HSU ,  Yao-Jen CHANG

IPC: H01L23/373 ,  B05C9/12

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

公开(公告)号：US20200288604A1

公开(公告)日：2020-09-10

申请号：US16792947

申请日：2020-02-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chun-Chieh WONG ,  Cheng-Yu WANG

IPC: H05K7/20

Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.