公开(公告)号：US20150016061A1

公开(公告)日：2015-01-15

申请号：US14320574

申请日：2014-06-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Cheng-Yu WANG

IPC: F04D29/70 ,  H05K7/20 ,  F04D17/08

CPC classification number: F04D29/703 ,  F04D17/16 ,  F04D29/4226 ,  F04D29/582 ,  G06F1/203

Abstract: A centrifugal fan module comprising a fan housing and an impeller is provided. The fan housing includes an air inlet and a sidewall. The sidewall is pivotally disposed in the fan housing to rotate in the rotational direction relative to the fan housing. A tongue portion is formed between the sidewall and the impeller, a pressurized region is formed from the tongue portion along the rotational direction to the air outlet, the pressurized region includes a strong airflow region and the dust-discharging hole is in the strong airflow region.

Abstract translation: 提供了包括风扇壳体和叶轮的离心风扇模块。 风扇壳体包括空气入口和侧壁。 侧壁可枢转地设置在风扇壳体中，以相对于风扇壳体沿旋转方向旋转。 在侧壁和叶轮之间形成有舌部，从舌部沿着旋转方向形成加压区域到空气出口，加压区域包括强气流区域，排灰孔位于强气流区域 。

公开(公告)号：US20140290914A1

公开(公告)日：2014-10-02

申请号：US14222676

申请日：2014-03-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Ing-Jer CHIOU ,  Cheng-Yu WANG

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined in the hollow tube body. The capillary structure is disposed on the first region. A diameter of the second region is larger than a diameter of the first region.

Abstract translation: 热管结构包括中空管体和多个毛细结构。 第一区域和第二区域被限定在中空管体中。 毛细结构设置在第一区域上。 第二区域的直径大于第一区域的直径。

公开(公告)号：US20140146472A1

公开(公告)日：2014-05-29

申请号：US14072758

申请日：2013-11-05

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chia-Ching NIU ,  Ing-Jer CHIOU ,  Cheng-Yu WANG

IPC: H05K7/20

CPC classification number: H05K7/20 ,  F04D29/40 ,  F28D15/02 ,  G06F1/20 ,  G06F1/203 ,  H05K7/20145 ,  H05K7/20445

Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Abstract translation: 电子装置包括上盖，与上盖结合的下盖和导热支柱。 由上盖和下盖形成容纳空间。 导热柱设置在容纳空间中并与上盖和下盖物理连接，以平衡上盖和下盖的温度。

公开(公告)号：US20140043763A1

公开(公告)日：2014-02-13

申请号：US13777326

申请日：2013-02-26

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chia-Ching NIU ,  Cheng-Yu WANG

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  G06F1/1616 ,  G06F1/1683 ,  G06F1/203

Abstract: A portable electronic system includes a portable device and a mobile device. The portable device includes a base, a bearing seat, and a connecting element. The base includes a fan and at least one first opening. The bearing seat includes at least one second opening. The connecting element connects the base and the bearing seat and includes a passage. The mobile device is detachably disposed at the bearing seat and includes at least one third opening. The base and the mobile device have corresponding passage and openings to bring heat airflow from inside of the mobile device to outside of the mobile device.

Abstract translation: 便携式电子系统包括便携式设备和移动设备。 便携式装置包括基座，轴承座和连接元件。 基座包括风扇和至少一个第一开口。 轴承座包括至少一个第二开口。 连接元件连接基座和轴承座并且包括通道。 移动装置可拆卸地设置在轴承座上并且包括至少一个第三开口。 基座和移动装置具有相应的通道和开口，以将热气流从移动装置的内部带到移动装置的外部。

公开(公告)号：US20240284610A1

公开(公告)日：2024-08-22

申请号：US18328046

申请日：2023-06-02

Applicant: ASUSTEK COMPUTER INC.

Inventor： Yu-Jung LIN ,  Ing-Jer CHIOU ,  Cheng-Yu WANG

IPC: H05K5/02 ,  B32B3/26 ,  B32B5/18 ,  B32B7/14 ,  B32B27/06

CPC classification number: H05K5/0211 ,  B32B3/266 ,  B32B5/18 ,  B32B7/14 ,  B32B27/065 ,  B32B2307/304 ,  B32B2307/7376 ,  B32B2457/00

Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.

公开(公告)号：US20210066160A1

公开(公告)日：2021-03-04

申请号：US16931560

申请日：2020-07-17

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Chang LEE ,  Chun-Chieh WONG ,  Cheng-Yu WANG ,  Tai-Min HSU ,  Yao-Jen CHANG

IPC: H01L23/373 ,  B05C9/12

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

公开(公告)号：US20200288604A1

公开(公告)日：2020-09-10

申请号：US16792947

申请日：2020-02-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chun-Chieh WONG ,  Cheng-Yu WANG

IPC: H05K7/20

Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

公开(公告)号：US20210219457A1

公开(公告)日：2021-07-15

申请号：US17132139

申请日：2020-12-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chun-Chieh WONG ,  Cheng-Yu WANG

IPC: H05K7/20 ,  G06F1/20

Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.

公开(公告)号：US20140168893A1

公开(公告)日：2014-06-19

申请号：US13787838

申请日：2013-03-07

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chia-Ching NIU ,  Cheng-Yu WANG

IPC: H05K7/20

CPC classification number: G06F1/203 ,  H04B1/036

Abstract: A heat dissipation apparatus with an antenna is provided. The heat dissipation apparatus includes a housing, a heat-insulation structure, a fan and an antenna. The heat-insulation structure is disposed on the housing and the heat-insulation structure has a plurality of heat dissipation holes. The fan is disposed in the housing and an air exhaust channel is formed between the fan and the heat-insulation structure. The antenna is disposed in the air exhaust channel.

Abstract translation: 提供了具有天线的散热装置。 散热装置包括壳体，绝热结构，风扇和天线。 绝热结构设置在壳体上，绝热结构具有多个散热孔。 风扇设置在壳体中，并且在风扇和隔热结构之间形成排气通道。 天线设置在排气通道中。