公开(公告)号：US11103039B2

公开(公告)日：2021-08-31

申请号：US16821126

申请日：2020-03-17

Applicant: ASUSTEK COMPUTER INC.

Inventor： Yi-Chen Yen ,  Shih-Wei Chiou ,  Yung-Hsiang Chen

IPC: A45C11/00

Abstract: A protective case adapted for an electronic device is provided. The protective case includes a plurality of plates, at least one pivot module, an outer covering layer, and an inner covering layer. Each plate includes an inner surface and an outer surface, and at least one recess is defined between the plates. The pivot module is disposed in the recess and is connected to the plates. The outer covering layer is bonded to the outer surface of each plate and covers the recess. The inner covering layer is bonded to the inner surface of each plate and covers the recess. A side edge of the outer surface adjacent to the recess includes a chamfer.

公开(公告)号：US11337324B2

公开(公告)日：2022-05-17

申请号：US16867904

申请日：2020-05-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Shih-Wei Chiou ,  Yang-Po Chiu ,  Ying-Ta Tseng

IPC: B23P25/00 ,  H05K5/02 ,  H05K5/00

Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.

公开(公告)号：US20200375050A1

公开(公告)日：2020-11-26

申请号：US16867904

申请日：2020-05-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Shih-Wei Chiou ,  Yang-Po Chiu ,  Ying-Ta Tseng

IPC: H05K5/02 ,  H05K5/00

Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.