公开(公告)号：US20130229774A1

公开(公告)日：2013-09-05

申请号：US13760645

申请日：2013-02-06

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ching-Hua CHEN ,  Shih-Kun CHOU ,  Yen Tse LIU ,  Shih-Ming LIN

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  G06F1/181 ,  G06F1/206 ,  H05K7/2039

Abstract: An electronic device is provided, and the electronic device includes a main body, an actuating module, a first linkage, a first casing and a thermal dissipating module. The actuating module is disposed in the main body. One side of the first linkage is connected with the actuating module. The first casing is connected with the other side of the first linkage. One side of the thermal dissipating module is disposed at the main body and the other side of the thermal dissipating module is disposed at the first casing. The actuating module controls the first linkage to rotate to separate the first casing from the main body so that the thermal dissipating module is exposed from the main body and the electronic device is switched from a closed state to an open state.

Abstract translation: 提供电子设备，电子设备包括主体，致动模块，第一连杆机构，第一壳体和散热模块。 致动模块设置在主体中。 第一联动装置的一侧与执行模块相连。 第一壳体与第一连杆的另一侧连接。 散热模块的一侧设置在主体上，散热模块的另一侧设置在第一壳体上。 致动模块控制第一联动装置旋转以将第一壳体与主体分开，使得散热模块从主体露出并且电子装置从关闭状态切换到打开状态。