-
公开(公告)号：US11715878B2
公开(公告)日：2023-08-01
申请号：US17476544
申请日：2021-09-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Zhi-Hua Feng , Chia-Ho Lin , Pin-Tang Chiu , Zhen-De Jiang
CPC classification number: H01Q9/0457 , H01Q1/48 , H01Q5/357 , H01Q9/0471
Abstract: A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.
-
Patent Agency Ranking
公开(公告)号：US11871512B2
公开(公告)日：2024-01-09
申请号：US17489927
申请日：2021-09-30
Applicant: ASUSTeK COMPUTER INC.
Inventor： Zhen-De Jiang , Pin-Tang Chiu , Chia-Ho Lin , Zhi-Hua Feng
CPC classification number: H05K1/0274 , H01Q1/48 , H05K1/0243 , H05K1/16 , H01Q23/00 , H05B45/30 , H05K2201/10098 , H05K2201/10106
Abstract: A circuit board includes a substrate, a driver circuit, at least one light-emitting element, a grounding circuit, and an antenna unit. The substrate includes a first circuit layer and a second circuit layer. The driver circuit is located on the first circuit layer. The light-emitting element is located on the first circuit layer and is electrically connected to the driver circuit, so that the driver circuit controls the light-emitting element to emit light. The grounding circuit is located on the second circuit layer and is electrically connected to the driver circuit. The grounding circuit includes a plurality of conductive traces, and the conductive traces are arranged toward one side to form a clearance area on the second circuit layer. The antenna unit is located on the first circuit layer and corresponds to the clearance area to receive and transmit a radio frequency signal.
-
公开(公告)号：US11381215B2
公开(公告)日：2022-07-05
申请号：US16417852
申请日：2019-05-21
Applicant: ASUSTeK COMPUTER INC.
Inventor： Pin-Tang Chiu , Chia-Ho Lin
Abstract: A wireless communication device is provided. The wireless communication device comprises a circuit board, a key module and a sensing module. The key module is electrically connected with at least one key through the circuit board. The sensing module is electrically connected with the circuit board, wherein the circuit board is taken as an induction conductor of the sensing module. Therefore, according to the wireless communication device disclosed by the disclosure, the functions of the key module, the sensing module and an antenna module are integrated on a same component, so that the component has three-in-one functions, and the efficiency of an antenna is further enhanced.
-
公开(公告)号：US11641054B2
公开(公告)日：2023-05-02
申请号：US16919365
申请日：2020-07-02
Applicant: ASUSTeK COMPUTER INC.
Inventor： Pei-Chuan Huang , Chia-Ho Lin , Pin-Tang Chiu , Ling Tien
Abstract: A communication device is provided here. The communication device includes a metal cover, a first radiator, and a second radiator. The metal cover includes a slot. The first radiator overlaps the slot in a first direction. A portion of the second radiator overlaps a portion of the first radiator in the first direction.
-
公开(公告)号：US20220117081A1
公开(公告)日：2022-04-14
申请号：US17489927
申请日：2021-09-30
Applicant: ASUSTeK COMPUTER INC.
Inventor： Zhen-De Jiang , Pin-Tang Chiu , Chia-Ho Lin , Zhi-Hua Feng
Abstract: A circuit board includes a substrate, a driver circuit, at least one light-emitting element, a grounding circuit, and an antenna unit. The substrate includes a first circuit layer and a second circuit layer. The driver circuit is located on the first circuit layer. The light-emitting element is located on the first circuit layer and is electrically connected to the driver circuit, so that the driver circuit controls the light-emitting element to emit light. The grounding circuit is located on the second circuit layer and is electrically connected to the driver circuit. The grounding circuit includes a plurality of conductive traces, and the conductive traces are arranged toward one side to form a clearance area on the second circuit layer. The antenna unit is located on the first circuit layer and corresponds to the clearance area to receive and transmit a radio frequency signal.
-
公开(公告)号：US20220102862A1
公开(公告)日：2022-03-31
申请号：US17476544
申请日：2021-09-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Zhi-Hua Feng , Chia-Ho Lin , Pin-Tang Chiu , Zhen-De Jiang
Abstract: A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.
-
-
-
-
-
Search Results
6
records
(took 0.012 seconds)
