公开(公告)号：US11715878B2

公开(公告)日：2023-08-01

申请号：US17476544

申请日：2021-09-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Zhi-Hua Feng ,  Chia-Ho Lin ,  Pin-Tang Chiu ,  Zhen-De Jiang

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q5/357

CPC classification number: H01Q9/0457 ,  H01Q1/48 ,  H01Q5/357 ,  H01Q9/0471

Abstract: A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.

公开(公告)号：US11871512B2

公开(公告)日：2024-01-09

申请号：US17489927

申请日：2021-09-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Zhen-De Jiang ,  Pin-Tang Chiu ,  Chia-Ho Lin ,  Zhi-Hua Feng

IPC: H05K1/02 ,  H05K1/16 ,  H01Q1/48 ,  H05B45/30 ,  H01Q23/00

CPC classification number: H05K1/0274 ,  H01Q1/48 ,  H05K1/0243 ,  H05K1/16 ,  H01Q23/00 ,  H05B45/30 ,  H05K2201/10098 ,  H05K2201/10106

Abstract: A circuit board includes a substrate, a driver circuit, at least one light-emitting element, a grounding circuit, and an antenna unit. The substrate includes a first circuit layer and a second circuit layer. The driver circuit is located on the first circuit layer. The light-emitting element is located on the first circuit layer and is electrically connected to the driver circuit, so that the driver circuit controls the light-emitting element to emit light. The grounding circuit is located on the second circuit layer and is electrically connected to the driver circuit. The grounding circuit includes a plurality of conductive traces, and the conductive traces are arranged toward one side to form a clearance area on the second circuit layer. The antenna unit is located on the first circuit layer and corresponds to the clearance area to receive and transmit a radio frequency signal.

公开(公告)号：US20220117081A1

公开(公告)日：2022-04-14

申请号：US17489927

申请日：2021-09-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Zhen-De Jiang ,  Pin-Tang Chiu ,  Chia-Ho Lin ,  Zhi-Hua Feng

IPC: H05K1/02 ,  H01Q1/48

Abstract: A circuit board includes a substrate, a driver circuit, at least one light-emitting element, a grounding circuit, and an antenna unit. The substrate includes a first circuit layer and a second circuit layer. The driver circuit is located on the first circuit layer. The light-emitting element is located on the first circuit layer and is electrically connected to the driver circuit, so that the driver circuit controls the light-emitting element to emit light. The grounding circuit is located on the second circuit layer and is electrically connected to the driver circuit. The grounding circuit includes a plurality of conductive traces, and the conductive traces are arranged toward one side to form a clearance area on the second circuit layer. The antenna unit is located on the first circuit layer and corresponds to the clearance area to receive and transmit a radio frequency signal.

公开(公告)号：US20220102862A1

公开(公告)日：2022-03-31

申请号：US17476544

申请日：2021-09-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Zhi-Hua Feng ,  Chia-Ho Lin ,  Pin-Tang Chiu ,  Zhen-De Jiang

IPC: H01Q9/04 ,  H01Q1/48

Abstract: A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.