公开(公告)号：US20230221078A1

公开(公告)日：2023-07-13

申请号：US17958429

申请日：2022-10-02

Applicant: ASUSTeK COMPUTER INC.

Inventor： Jung-Kai Chang ,  Chi-Yeh Chen

IPC: F28D15/02

CPC classification number: F28D15/0275 ,  F28D2021/0029

Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.

公开(公告)号：US12181224B2

公开(公告)日：2024-12-31

申请号：US17958429

申请日：2022-10-02

Applicant: ASUSTeK COMPUTER INC.

Inventor： Jung-Kai Chang ,  Chi-Yeh Chen

IPC: F28D15/02 ,  F28D21/00

Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.

公开(公告)号：US12167553B2

公开(公告)日：2024-12-10

申请号：US17974497

申请日：2022-10-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Hui He ,  Wei Tang ,  Jung-Kai Chang ,  Yuan-Yu Lin

IPC: H05K5/02

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.

公开(公告)号：US20230354534A1

公开(公告)日：2023-11-02

申请号：US17974497

申请日：2022-10-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Hui He ,  Wei Tang ,  Jung-Kai Chang ,  Yuan-Yu Lin

IPC: H05K5/02

CPC classification number: H05K5/0221 ,  H05K5/0269

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.