公开(公告)号：US11515231B2

公开(公告)日：2022-11-29

申请号：US16931560

申请日：2020-07-17

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Chang Lee ,  Chun-Chieh Wong ,  Cheng-Yu Wang ,  Tai-Min Hsu ,  Yao-Jen Chang

IPC: H01L23/373 ,  B05C9/12 ,  B05D5/12

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.