公开(公告)号：US11522580B2

公开(公告)日：2022-12-06

申请号：US17137553

申请日：2020-12-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： An-Yao Lee ,  Szu-Lung Yen ,  Cheng-Yu Wang

IPC: H04B5/00 ,  G06K19/07 ,  H04W4/80 ,  H01Q7/00

Abstract: A near field communication device and a method of determining the position of a tag are provided. The near field communication device includes a first coil, a second coil, and a control circuit. One end of the first coil is coupled to a first grounding end. One end of the second coil is coupled to a second grounding end. The control circuit includes a first current pin and a second current pin. The first current pin is coupled to the other end of the first coil. The second current pin is coupled to the other end of the second coil. The control circuit transmits a first current signal to the first coil by the first current pin, and transmits a second current signal to the second coil by the second current pin, the control circuit analyzes the change of the first current signal and the change of the second current signal to determine whether the position of a tag is close to the first coil or close to the second coil.

公开(公告)号：US20150289415A1

公开(公告)日：2015-10-08

申请号：US14675772

申请日：2015-04-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chun-Chieh Wong ,  Cheng-Yu Wang ,  Ing-Jer Chiou

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  H01L21/4882 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot.

Abstract translation: 应用于散热模块的散热片包括翅片本体，穿透部分和至少一个弯曲部分。 穿透部形成在翅片体上，并且包括槽，第一弯曲壁和第二弯曲壁。 第一弯曲壁和第二弯曲壁形成在槽的相对侧。 弯曲部分形成在翅片体上并与槽的一端相邻。

公开(公告)号：US12039093B2

公开(公告)日：2024-07-16

申请号：US17567360

申请日：2022-01-03

Applicant: ASUSTeK COMPUTER INC.

Inventor： Cheng-Yu Wang ,  Shao-Kai Liu ,  Yu-Hsiang Huang ,  Bo-Hua Yang

IPC: G06F21/00 ,  G06F13/40 ,  G06F21/35 ,  G06F21/60 ,  G06F21/78

CPC classification number: G06F21/78 ,  G06F13/4068 ,  G06F21/35 ,  G06F21/602

Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.

公开(公告)号：US11172594B2

公开(公告)日：2021-11-09

申请号：US16792947

申请日：2020-02-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chun-Chieh Wong ,  Cheng-Yu Wang

IPC: H05K7/20 ,  H01L23/42 ,  G06F1/20

Abstract: A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

公开(公告)号：US20150327400A1

公开(公告)日：2015-11-12

申请号：US14705975

申请日：2015-05-07

Applicant: ASUSTeK COMPUTER INC.

Inventor： Cheng-Yu Wang

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F2200/201 ,  H05K7/20154 ,  H05K7/20263 ,  H05K7/20272

Abstract: An electronic system includes an expansion base and an electronic device. The expansion base includes a base body, a first pipe line, a liquid cooler and a driving unit. The base body includes a first connecting portion disposed in the base body. The liquid cooler is connected to the first connecting portion via the first pipe line. The driving unit connects the first pipe line. The electronic device includes a main body, a second pipe line and a liquid block. The main body includes a second connecting portion, and the second pipe line is connected to the second connection portion. The liquid block is connected to the second connecting portion via the second pipe line. The first connecting portion can be connected to the second connecting portion to form a circulation flow channel to drive heat exchange medium in the circulation flow channel by the driving unit.

Abstract translation: 电子系统包括扩展基座和电子设备。 膨胀基座包括基体，第一管线，液体冷却器和驱动单元。 基体包括设置在基体中的第一连接部。 液体冷却器经由第一管路连接到第一连接部分。 驱动单元连接第一条管路。 电子装置包括主体，第二管线和液体块。 主体包括第二连接部分，第二管线连接到第二连接部分。 液体块通过第二管线连接到第二连接部分。 第一连接部分可以连接到第二连接部分，以形成循环流动通道，以通过驱动单元驱动循环流动通道中的热交换介质。

公开(公告)号：US09313915B2

公开(公告)日：2016-04-12

申请号：US14072758

申请日：2013-11-05

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Ching Niu ,  Ing-Jer Chiou ,  Cheng-Yu Wang

IPC: H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  H05K1/00 ,  H01R13/46 ,  H05K5/00 ,  H01L23/34 ,  F28F7/00 ,  F28D15/00 ,  G06F1/20 ,  F28D15/02 ,  F04D29/40

CPC classification number: H05K7/20 ,  F04D29/40 ,  F28D15/02 ,  G06F1/20 ,  G06F1/203 ,  H05K7/20145 ,  H05K7/20445

Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Abstract translation: 电子装置包括上盖，与上盖结合的下盖和导热支柱。 由上盖和下盖形成容纳空间。 导热柱设置在容纳空间中并与上盖和下盖物理连接，以平衡上盖和下盖的温度。

公开(公告)号：US11515231B2

公开(公告)日：2022-11-29

申请号：US16931560

申请日：2020-07-17

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Chang Lee ,  Chun-Chieh Wong ,  Cheng-Yu Wang ,  Tai-Min Hsu ,  Yao-Jen Chang

IPC: H01L23/373 ,  B05C9/12 ,  B05D5/12

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

公开(公告)号：US11452232B2

公开(公告)日：2022-09-20

申请号：US17132139

申请日：2020-12-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chun-Chieh Wong ,  Cheng-Yu Wang

IPC: H05K7/20 ,  G06F1/20

Abstract: Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.

公开(公告)号：US09645620B2

公开(公告)日：2017-05-09

申请号：US14705975

申请日：2015-05-07

Applicant: ASUSTek COMPUTER INC.

Inventor： Cheng-Yu Wang

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F2200/201 ,  H05K7/20154 ,  H05K7/20263 ,  H05K7/20272

Abstract: An electronic system includes an expansion base and an electronic device. The expansion base includes a base body, a first pipe line, a liquid cooler and a driving unit. The base body includes a first connecting portion disposed in the base body. The liquid cooler is connected to the first connecting portion via the first pipe line. The driving unit connects the first pipe line. The electronic device includes a main body, a second pipe line and a liquid block. The main body includes a second connecting portion, and the second pipe line is connected to the second connection portion. The liquid block is connected to the second connecting portion via the second pipe line. The first connecting portion can be connected to the second connecting portion to form a circulation flow channel to drive heat exchange medium in the circulation flow channel by the driving unit.

公开(公告)号：US09341195B2

公开(公告)日：2016-05-17

申请号：US14320574

申请日：2014-06-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Cheng-Yu Wang

IPC: F04D29/70 ,  H05K7/20 ,  F04D17/08 ,  G06F1/20 ,  F04D17/16 ,  F04D29/42 ,  F04D29/58

CPC classification number: F04D29/703 ,  F04D17/16 ,  F04D29/4226 ,  F04D29/582 ,  G06F1/203

Abstract: A centrifugal fan module comprising a fan housing and an impeller is provided. The fan housing includes an air inlet and a sidewall. The sidewall is pivotally disposed in the fan housing to rotate in the rotational direction relative to the fan housing. A tongue portion is formed between the sidewall and the impeller, a pressurized region is formed from the tongue portion along the rotational direction to the air outlet, the pressurized region includes a strong airflow region and the dust-discharging hole is in the strong airflow region.

Abstract translation: 提供了包括风扇壳体和叶轮的离心风扇模块。 风扇壳体包括空气入口和侧壁。 侧壁可枢转地设置在风扇壳体中，以相对于风扇壳体沿旋转方向旋转。 在侧壁和叶轮之间形成有舌部，从舌部沿着旋转方向形成加压区域到空气出口，加压区域包括强气流区域，排灰孔位于强气流区域 。