公开(公告)号：US20220190464A1

公开(公告)日：2022-06-16

申请号：US17653628

申请日：2022-03-04

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Marco Gavagnin ,  Markus Leitgeb ,  Ahmad Bader Alothman Alterkawi ,  Ferdinand Lutschounig ,  Heinz Moitzi ,  Thomas Krivec ,  Gernot Grober ,  Erich Schlaffer ,  Mike Morianz ,  Rainer Frauwallner ,  Hubert Haidinger ,  Gernot Schulz ,  Gernot Gmunder

IPC分类号： H01Q1/22 ,  H05K1/02 ,  B33Y80/00 ,  B33Y10/00 ,  H01Q9/04

摘要： A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.

公开(公告)号：US20190110366A1

公开(公告)日：2019-04-11

申请号：US16153565

申请日：2018-10-05

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Marco Gavagnin ,  Markus Leitgeb ,  Jonathan Silvano de Sousa ,  Ferdinand Lutschounig ,  Heinz Moitzi ,  Thomas Krivec ,  Gernot Grober ,  Erich Schlaffer ,  Mike Morianz ,  Rainer Frauwallner ,  Hubert Haidinger ,  Gernot Schulz ,  Gernot Gmunder

IPC分类号： H05K3/46 ,  H05K1/05 ,  H05K1/16 ,  H05K1/18 ,  H05K1/02 ,  H05K1/09

摘要： A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.