-
1.发明授权Method for making a dual-textured food substrate having large seasoning bits 失效制造具有大调味料的双重纹理食品基材的方法公开(公告)号：US07074446B2
公开(公告)日：2006-07-11
申请号：US10755577
申请日：2004-01-12
IPC分类号： A23P1/08
摘要： Method for making a dual-textured food substrate having large seasoning bits whereby the bits are substantially adhered to the food substrate, or chip. A first topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip having a first texture. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits. A second topping having a second texture is then placed and melted onto the chip. The food ingredient properties are optimized to provide a shelf-stable dual-textured food product.
摘要翻译： 用于制造具有大的调味料的双重纹理的食品基材的方法，由此这些比特基本上粘附到食品基材或芯片上。 将包含大调味料和干粘合剂的第一顶料施加到具有第一织构的熟片上。 然后将顶部煮熟的芯片加热到一定温度，使得干燥的粘合剂经历玻璃化转变并沿着钻头向下流动到钻头和食品基底接触点。 然后将顶部熟的芯片进行改变的工艺条件，例如冷却，粘合剂硬化，并且在芯片和调味料之间形成粘合。 然后将具有第二纹理的第二顶部放置并熔化到芯片上。 食品成分性能得到优化，可提供货架稳定的双重纹理食品。
-
公开(公告)号：US08216620B2
公开(公告)日：2012-07-10
申请号：US11327600
申请日：2006-01-06
IPC分类号： A23P1/08
摘要： A dual-textured food substrate having large seasoning bits whereby the bits are substantially adhered to the food substrate, or chip with a dry adhesive. The food substrate has a non-particulate second topping that is softer than the food substrate. The underlying cooked food substrate is substantially flat. The food ingredient properties are optimized to provide a shelf-stable dual-textured food product.
摘要翻译： 具有大的调味料的双重纹理的食品基材，由此这些比特基本上粘附到食品基材上，或者用干燥的粘合剂将其切片。 食品基材具有比食品基材更柔软的非颗粒第二顶部。 下面的熟食基材基本上是平的。 食品成分性能得到优化，可提供货架稳定的双重纹理食品。
-
公开(公告)号：US07569242B2
公开(公告)日：2009-08-04
申请号：US11330631
申请日：2006-01-12
申请人： Keith Alan Barber , Adrianna Ashley Heywood , K. Michael King , Stephen Louis Rice , Richard James Ruegg
发明人： Keith Alan Barber , Adrianna Ashley Heywood , K. Michael King , Stephen Louis Rice , Richard James Ruegg
IPC分类号： A23P1/08
摘要： A snack food having large three-dimensional seasoning bits whereby the bits are substantially adhered to the food substrate, or chip. A topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits.
摘要翻译： 一种具有大的三维调味料的小吃食品，由此这些馅饼基本上粘附在食品基材或芯片上。 将包括大调味料和干燥粘合剂的顶部施加到煮熟的芯片上。 然后将顶部煮熟的芯片加热到一定温度，使得干燥的粘合剂经历玻璃化转变并沿着钻头向下流动到钻头和食品基底接触点。 然后将顶部熟的芯片进行改变的工艺条件，例如冷却，粘合剂硬化，并且在芯片和调味料之间形成粘合。
-
公开(公告)号：US07074445B2
公开(公告)日：2006-07-11
申请号：US10696970
申请日：2003-10-30
申请人： Keith Alan Barber , Adrianna Ashley Heywood , K. Michael King , Stephen Louis Rice , Richard James Ruegg
发明人： Keith Alan Barber , Adrianna Ashley Heywood , K. Michael King , Stephen Louis Rice , Richard James Ruegg
IPC分类号： A23P1/08
摘要： A method for adhering large three-dimensional seasoning bits to a snack food base whereby the bits are substantially adhered to the food substrate, or chip. A topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits.
摘要翻译： 一种用于将大型三维调味料料浆料粘贴到小吃食品基料上的方法，由此使得这些料料基本上粘附到食品基材或芯片上。 将包括大调味料和干燥粘合剂的顶部施加到煮熟的芯片上。 然后将顶部煮熟的芯片加热到一定温度，使得干燥的粘合剂经历玻璃化转变并沿着钻头向下流动到钻头和食品基底接触点。 然后将顶部熟的芯片进行改变的工艺条件，例如冷却，粘合剂硬化，并且在芯片和调味料之间形成粘合。
-
-
-
搜索结果
4 条记录 (耗时 0.02 秒)
