公开(公告)号：US20030042006A1

公开(公告)日：2003-03-06

申请号：US10229831

申请日：2002-08-28

Applicant: Advanced Materials Technologies Pte. Ltd.

Inventor： Randall M. German ,  Lye-King Tan ,  John Johnson

IPC: F28F007/00 ,  F28D015/00 ,  B23P006/00

CPC classification number: H01L23/427 ,  F28D15/0275 ,  F28D2015/0225 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

Abstract translation: 集成电路芯片运行过程中的散热是一个不断恶化的老问题。 本发明通过将嵌入的热管直接放置在芯片的正下方而显着地改善了这一点。 使用粉末注射成型，首先将包装的下部形成为包括一个或多个空腔的初始绿色部分。 然后，后者衬有被设计成在烧结之后产生多孔材料的原料，此时将工作流体引入多孔孔并密封，由此形成位于芯片正下方的一个或多个热管。 然后将后者密封在外壳内。 在操作期间，由芯片产生的热量有效地传递到外壳外部的点。 还描述了用于制造该结构的方法。