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    LOOP HEAT PIPE AND ELECTRONIC DEVICE
    2.
    发明申请
    LOOP HEAT PIPE AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20190204017A1

    公开(公告)日：2019-07-04

    申请号：US16202626

    申请日：2018-11-28

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Takahiko KISO ,  Nobuyuki KURASHIMA

    IPC分类号： F28D15/04 ,  H01L23/427

    CPC分类号： F28D15/0266 ,  F28D15/0241 ,  F28D2015/0225

    摘要： A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.

    ANTI-GRAVITY HEAT PIPE DEVICE
    3.
    发明申请
    ANTI-GRAVITY HEAT PIPE DEVICE 审中-公开

    公开(公告)号：US20170241717A1

    公开(公告)日：2017-08-24

    申请号：US15430448

    申请日：2017-02-11

    申请人： COOLER MASTER CO., LTD.

    发明人： Chien-Hung SUN ,  Tzu-Wei GU

    IPC分类号： F28D15/04

    CPC分类号： F28D15/04 ,  F28D15/046 ,  F28D2015/0216 ,  F28D2015/0225

    摘要： A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

    THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
    8.
    发明申请
    THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS 审中-公开
    使用微热管对电子元件进行热管理的热管理系统

    公开(公告)号：US20100155033A1

    公开(公告)日：2010-06-24

    申请号：US12607619

    申请日：2009-10-28

    申请人： Woodrow W. Holley ,  Jerome P. Fanucci

    发明人： Woodrow W. Holley ,  Jerome P. Fanucci

    IPC分类号： F28D15/02 ,  B21D53/02

    CPC分类号： F28D15/046 ,  F28D2015/0225 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.

    摘要翻译： 热管理系统包括基座元件和设置用于从发热元件到基座元件的热传递的发热元件。 粘附区域包括在发热元件和基底元件之间物理连接的粘附元件。 与粘附区分开的传热区包括在发热元件和基底元件之间的热管。 热管包括在蒸发器部分和冷凝器部分之间的循环流动路径以及循环流动路径上的工作流体。