公开(公告)号：US20240314934A1

公开(公告)日：2024-09-19

申请号：US18121487

申请日：2023-03-14

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM ,  Aslam YEHIA ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Hoa DO

IPC: H05K1/18 ,  H05K5/00 ,  H05K7/10 ,  H05K7/20

CPC classification number: H05K1/181 ,  H05K5/0026 ,  H05K7/10 ,  H05K7/20836

Abstract: An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.