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公开(公告)号:US20240314934A1
公开(公告)日:2024-09-19
申请号:US18121487
申请日:2023-03-14
Applicant: Advanced Micro Devices, Inc.
Inventor: Gamal REFAI-AHMED , Suresh RAMALINGAM , Aslam YEHIA , Chi-Yi CHAO , Md Malekkul ISLAM , Hoa DO
CPC classification number: H05K1/181 , H05K5/0026 , H05K7/10 , H05K7/20836
Abstract: An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.
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公开(公告)号:US20250069579A1
公开(公告)日:2025-02-27
申请号:US18236221
申请日:2023-08-21
Applicant: Advanced Micro Devices, Inc. , XILINX, INC.
Inventor: Gamal REFAI-AHMED , Christopher JAGGERS , Hoa DO , Md Malekkul ISLAM , Paul Theodore ARTMAN , Sukesh SHENOY , Suresh RAMALINGAM , Muhammad Afiq Bin In BAHAROM
IPC: G10K11/178
Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.
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