公开(公告)号：US20240371711A1

公开(公告)日：2024-11-07

申请号：US18144164

申请日：2023-05-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ting CHEN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/66 ,  H03H9/52 ,  H03H9/64

Abstract: A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.

公开(公告)号：US20240373752A1

公开(公告)日：2024-11-07

申请号：US18144163

申请日：2023-05-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ting CHEN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG

IPC: H10N30/00 ,  H10N30/20 ,  H10N30/87

Abstract: A semiconductor substrate and a package structure including the same are provided. The semiconductor substrate includes a first surface and a second surface. The first surface includes a filtering region. The second surface is opposite to the first surface and includes an amplifying region.