公开(公告)号：US10217649B2

公开(公告)日：2019-02-26

申请号：US15619415

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jin-Yuan Lai ,  Tang-Yuan Chen ,  Ying-Xu Lu ,  Dao-Long Chen ,  Kwang-Lung Lin ,  Chih-Pin Hung ,  Tse-Chuan Chou ,  Ming-Hung Chen ,  Chi-Hung Pan

IPC: H01L23/49 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.