公开(公告)号：US20180334380A1

公开(公告)日：2018-11-22

申请号：US15599377

申请日：2017-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang HSIAO ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Chia-Hung SHEN

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0072 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2207/07 ,  B81C3/001 ,  B81C2201/013

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

公开(公告)号：US20210276860A1

公开(公告)日：2021-09-09

申请号：US17330245

申请日：2021-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang HSIAO ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Chia-Hung SHEN

IPC: B81C3/00 ,  B81C1/00

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.