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公开(公告)号：US20210257988A1
公开(公告)日：2021-08-19
申请号：US16794112
申请日：2020-02-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chi Sheng TSENG , Lu-Ming LAI , Ching-Han HUANG , Kuo-Hua LAI , Hui-Chung LIU
Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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公开(公告)号：US20180265347A1
公开(公告)日：2018-09-20
申请号：US15921265
申请日：2018-03-14
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Ming Yen LEE , Chia Hao SUNG , Ching-Han HUANG , Yu-Hsuan TSAI
Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.
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公开(公告)号：US20230208394A1
公开(公告)日：2023-06-29
申请号：US18112464
申请日：2023-02-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chi Sheng TSENG , Lu-Ming LAI , Ching-Han HUANG , Kuo-Hua LAI , Hui-Chung LIU
CPC classification number: H03H9/2426 , H03H3/0073 , H03H9/1057 , H03H9/08 , H03H9/0547 , H03L1/028 , H03L1/04
Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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公开(公告)号：US20210206628A1
公开(公告)日：2021-07-08
申请号：US16734060
申请日：2020-01-03
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yu-Hsuan TSAI , Lu-Ming LAI , Chien-Wei FANG , Ching-Han HUANG
Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.
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公开(公告)号：US20250096774A1
公开(公告)日：2025-03-20
申请号：US18967532
申请日：2024-12-03
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chi Sheng TSENG , Lu-Ming LAI , Ching-Han HUANG , Kuo-Hua LAI , Hui-Chung LIU
Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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Patent Agency Ranking
公开(公告)号：US20200283288A1
公开(公告)日：2020-09-10
申请号：US16885150
申请日：2020-05-27
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Ming Yen LEE , Chia-Hao SUNG , Ching-Han HUANG , Yu-Hsuan TSAI
IPC: B81B7/00 , B81B3/00 , B81C1/00 , H01L23/538 , H01L23/48 , H01L23/522 , H01L23/52 , H01L23/525 , H01L21/66 , B81C3/00 , H01L23/31 , H01L23/13 , H01L23/12 , H01L23/28
Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.
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公开(公告)号：US20180066982A1
公开(公告)日：2018-03-08
申请号：US15687090
申请日：2017-08-25
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yu-Min PENG , Ching-Han HUANG , Lu-Ming LAI
IPC: G01J1/04
CPC classification number: G01J1/0407 , G01J1/0422
Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.
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公开(公告)号：US20210276860A1
公开(公告)日：2021-09-09
申请号：US17330245
申请日：2021-05-25
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsu-Liang HSIAO , Lu-Ming LAI , Ching-Han HUANG , Chia-Hung SHEN
Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
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公开(公告)号：US20210036658A1
公开(公告)日：2021-02-04
申请号：US17074618
申请日：2020-10-19
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chi Sheng TSENG , Lu-Ming LAI , Ching-Han HUANG , Hui-Chung LIU , Kuo-Hua LAI , Cheng-Ling HUANG
IPC: H03B5/04 , H01L23/13 , H01L23/00 , H01L23/36 , H03B5/30 , H01L23/14 , B81B7/00 , H03B5/36 , H03L1/04 , H03B1/02
Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
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公开(公告)号：US20190267298A1
公开(公告)日：2019-08-29
申请号：US16282147
申请日：2019-02-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsin Lin WU , Yu-Hsuan TSAI , Chang Chin TSAI , Lu-Ming LAI , Ching-Han HUANG
IPC: H01L23/20 , H01L23/043 , H01L23/053 , H01L23/10 , H01L23/26 , H01L21/48
Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.
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