公开(公告)号：US20210206628A1

公开(公告)日：2021-07-08

申请号：US16734060

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Chien-Wei FANG ,  Ching-Han HUANG

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.