公开(公告)号：US20200303294A1

公开(公告)日：2020-09-24

申请号：US16358378

申请日：2019-03-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin CHANG ,  Tsu-Hsiu WU ,  Tsung-Yueh TSAI

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

公开(公告)号：US20210296244A1

公开(公告)日：2021-09-23

申请号：US17336072

申请日：2021-06-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin CHANG ,  Tsu-Hsiu WU ,  Tsung-Yueh TSAI

IPC: H01L23/538 ,  H01L33/62 ,  H01S5/022

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.