公开(公告)号：US20190107897A1

公开(公告)日：2019-04-11

申请号：US15726034

申请日：2017-10-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kai OU ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Chih-Ming HUNG

IPC: G06F3/02 ,  G06F3/041 ,  H01L41/053 ,  G06F3/01 ,  H01L41/319 ,  H01L41/293 ,  H01L41/23

Abstract: An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

公开(公告)号：US20180269347A1

公开(公告)日：2018-09-20

申请号：US15462480

申请日：2017-03-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Nien CHEN ,  Yu-Ting CHIEN ,  Yueh-Lung LIN ,  Tsung-Yueh TSAI

IPC: H01L31/167 ,  H01L33/44 ,  H01L33/62 ,  H01L33/54 ,  H01L31/0216 ,  H01L31/02 ,  H01L31/18 ,  H01L25/16

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02164 ,  H01L31/1876 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/005

Abstract: An optical device includes a carrier including a light transmitting layer and a light shielding layer disposed on the light transmitting layer. The optical device further includes a light emitter disposed on the carrier and a light detector disposed on the carrier. The optical device further includes a light transmitting encapsulant encapsulating the light emitter and the light detector, and a light shielding wall disposed in the light transmitting encapsulant and in contact with the light transmitting encapsulant and the light shielding layer.

公开(公告)号：US20220020885A1

公开(公告)日：2022-01-20

申请号：US17488076

申请日：2021-09-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Tsung-Yueh TSAI ,  Teck-Chong LEE

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

公开(公告)号：US20180294247A1

公开(公告)日：2018-10-11

申请号：US15918906

申请日：2018-03-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming HUNG ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Jen-Kai OU

IPC: H01L23/00 ,  H01L27/146 ,  H01L21/56

Abstract: A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

公开(公告)号：US20220238502A1

公开(公告)日：2022-07-28

申请号：US17719280

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh TSAI ,  Meng-Jen WANG ,  Yu-Fang TSAI ,  Meng-Jung CHUANG

IPC: H01L25/16 ,  H01L23/31 ,  H01L21/52 ,  H01L23/538 ,  H01L21/48

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US20210175205A1

公开(公告)日：2021-06-10

申请号：US17180364

申请日：2021-02-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming HUNG ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Jen-Kai OU

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/56 ,  H01L27/146 ,  H01L23/31 ,  G06K9/00

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US20200303294A1

公开(公告)日：2020-09-24

申请号：US16358378

申请日：2019-03-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin CHANG ,  Tsu-Hsiu WU ,  Tsung-Yueh TSAI

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

公开(公告)号：US20240332274A1

公开(公告)日：2024-10-03

申请号：US18740417

申请日：2024-06-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh TSAI ,  Meng-Jen WANG ,  Yu-Fang TSAI ,  Meng-Jung CHUANG

IPC: H01L25/16 ,  H01L21/48 ,  H01L21/52 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L21/4817 ,  H01L21/52 ,  H01L23/3128 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/165

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US20230335533A1

公开(公告)日：2023-10-19

申请号：US18212158

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming HUNG ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Jen-Kai OU

IPC: H01L21/56 ,  H01L23/31 ,  H01L27/146 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/544 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  G06V40/1318 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/95001 ,  H01L2924/014 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19105

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US20210296244A1

公开(公告)日：2021-09-23

申请号：US17336072

申请日：2021-06-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin CHANG ,  Tsu-Hsiu WU ,  Tsung-Yueh TSAI

IPC: H01L23/538 ,  H01L33/62 ,  H01S5/022

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.