公开(公告)号：US20210217701A1

公开(公告)日：2021-07-15

申请号：US16742788

申请日：2020-01-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Min Lung HUANG ,  Hung-Jung TU ,  Hsin Hsiang WANG ,  Chih-Wei HUANG ,  Shiuan-Yu LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00 ,  H01L21/768

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.