公开(公告)号：US20220084914A1

公开(公告)日：2022-03-17

申请号：US17023267

申请日：2020-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Tsung CHIU ,  Hui-Ying HSIEH ,  Chun Hao CHIU ,  Chiuan-You DING

IPC: H01L23/495

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.