公开(公告)号：US20200243427A1

公开(公告)日：2020-07-30

申请号：US16846085

申请日：2020-04-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui Hua LEE ,  Chun Hao CHIU ,  Hui-Ying Hsieh ,  Kuo-Hua CHEN ,  Chi-Tsung CHIU

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L25/16

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

公开(公告)号：US20170365543A1

公开(公告)日：2017-12-21

申请号：US15621970

申请日：2017-06-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui Hua LEE ,  Chun Hao CHIU ,  Hui-Ying Hsieh ,  Kuo-Hua CHEN ,  Chi-Tsung CHIU

IPC: H01L23/495

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

公开(公告)号：US20220084914A1

公开(公告)日：2022-03-17

申请号：US17023267

申请日：2020-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Tsung CHIU ,  Hui-Ying HSIEH ,  Chun Hao CHIU ,  Chiuan-You DING

IPC: H01L23/495

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.