公开(公告)号：US20240275038A1

公开(公告)日：2024-08-15

申请号：US18108495

申请日：2023-02-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih CHO

IPC: H01Q1/46 ,  H01Q1/22

CPC classification number: H01Q1/46 ,  H01Q1/2283

Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier and an interconnection structure disposed over the carrier and having a plurality of conductive pads. One of the plurality of conductive pads is adjustable to function as a functional pad or a non-functional pad for an antenna unit.

公开(公告)号：US20240120288A1

公开(公告)日：2024-04-11

申请号：US17962354

申请日：2022-10-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin LAI ,  Chih-Cheng LEE ,  Shao-Lun YANG ,  Wei-Chih CHO

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.

公开(公告)号：US20220301995A1

公开(公告)日：2022-09-22

申请号：US17209085

申请日：2021-03-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih CHO ,  Chun-Hung YEH ,  Tsung-Wei LU

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

公开(公告)号：US20220246533A1

公开(公告)日：2022-08-04

申请号：US17163213

申请日：2021-01-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih CHO ,  Shao-Lun Yang ,  Chun-Hung YEH ,  Tsung-Wei LU

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.