公开(公告)号：US20250079308A1

公开(公告)日：2025-03-06

申请号：US18239726

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Chun-Kai CHANG ,  Chao Wei LIU

IPC: H01L23/528 ,  H01L23/498 ,  H01L25/16

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

公开(公告)号：US20240180487A1

公开(公告)日：2024-06-06

申请号：US18073522

申请日：2022-12-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Kai CHANG

IPC: A61B5/00

CPC classification number: A61B5/6801 ,  A61B2562/164 ,  A61B2562/166

Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier having a component side and a sensing side opposite to the component side. The sensing side has a thinned portion. The electronic device also includes a first sensing element disposed over the sensing side and a second sensing element disposed over the sensing side. The first sensing element and the second sensing element are arranged along a primary direction of the electronic device. The thinned portion is between the first sensing element and the second sensing element and is configured to provide adjustment to a relative position between the first sensing element and the second sensing element.