公开(公告)号：US20210210433A1

公开(公告)日：2021-07-08

申请号：US16734989

申请日：2020-01-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

公开(公告)号：US20230301591A1

公开(公告)日：2023-09-28

申请号：US17705213

申请日：2022-03-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: A61B5/00 ,  H05K5/02 ,  H01F7/02

CPC classification number: A61B5/6801 ,  H05K5/0217 ,  H01F7/02 ,  A61B2562/164

Abstract: An electronic device is provided. The electronic device includes a flexible body having a first portion and a second portion, an electronic component in the first portion and the second portion of the flexible body, a first magnetic element in the first portion of the flexible body and a second magnetic element in the second portion of the flexible body. The first magnetic and the second magnetic generate a repulsive force with each other when the flexible body is bent and the first portion and the second portion of the flexible body are moved toward each other.

公开(公告)号：US20230114278A1

公开(公告)日：2023-04-13

申请号：US18080640

申请日：2022-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.

公开(公告)号：US20220310521A1

公开(公告)日：2022-09-29

申请号：US17840435

申请日：2022-06-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/16 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

公开(公告)号：US20250079308A1

公开(公告)日：2025-03-06

申请号：US18239726

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Chun-Kai CHANG ,  Chao Wei LIU

IPC: H01L23/528 ,  H01L23/498 ,  H01L25/16

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

公开(公告)号：US20240126327A1

公开(公告)日：2024-04-18

申请号：US17966700

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU ,  Wei-Hao CHANG ,  Yung-I YEH ,  Jen-Chieh KAO ,  Tun-Ching PI ,  Ming-Hung CHEN ,  Hui-Ping JIAN ,  Shang-Lin WU

IPC: G06F1/16

CPC classification number: G06F1/163 ,  G06F1/1632

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

公开(公告)号：US20250132261A1

公开(公告)日：2025-04-24

申请号：US19001307

申请日：2024-12-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

公开(公告)号：US20210343649A1

公开(公告)日：2021-11-04

申请号：US16864092

申请日：2020-04-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.