公开(公告)号：US12040321B2

公开(公告)日：2024-07-16

申请号：US17949139

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng Tsai ,  Ying-Chung Chen

IPC: H01L25/16 ,  G01J1/04

CPC classification number: H01L25/167 ,  G01J1/0403

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

公开(公告)号：US11276797B2

公开(公告)日：2022-03-15

申请号：US16384847

申请日：2019-04-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng Tsai ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Ying-Chung Chen

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/0232

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.