公开(公告)号：US20230223354A1

公开(公告)日：2023-07-13

申请号：US18121568

申请日：2023-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Da LIN ,  Meng-Jen WANG ,  Hung Chen KUO ,  Wen Jin HUANG

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/04 ,  H01L21/3213 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/561 ,  H01L23/04 ,  H01L21/32131 ,  H01L23/3114 ,  H01L21/563

Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

公开(公告)号：US20210327822A1

公开(公告)日：2021-10-21

申请号：US16852256

申请日：2020-04-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Da LIN ,  Meng-Jen WANG ,  Hung Chen KUO ,  Wen Jin HUANG

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/3213 ,  H01L23/04

Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.