公开(公告)号：US20230199362A1

公开(公告)日：2023-06-22

申请号：US17560179

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC: H04R1/10

CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1091

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

公开(公告)号：US20250133322A1

公开(公告)日：2025-04-24

申请号：US19006183

申请日：2024-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC: H04R1/10

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.