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公开(公告)号：US20230136046A1
公开(公告)日：2023-05-04
申请号：US17513748
申请日：2021-10-28
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsiang-Cheng TSAI , Jui-Che WU
Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.
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