公开(公告)号：US20240096864A1

公开(公告)日：2024-03-21

申请号：US17949139

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Ying-Chung CHEN

IPC: H01L25/16 ,  G01J1/04

CPC classification number: H01L25/167 ,  G01J1/0403

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

公开(公告)号：US20240243207A1

公开(公告)日：2024-07-18

申请号：US18096355

申请日：2023-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Ying-Chung CHEN ,  Kuo-Hua LAI

IPC: H01L31/0203 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  H01L31/02164

Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.

公开(公告)号：US20230136046A1

公开(公告)日：2023-05-04

申请号：US17513748

申请日：2021-10-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Jui-Che WU

IPC: H01L25/16 ,  H01L23/13

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.