公开(公告)号：US11991827B2

公开(公告)日：2024-05-21

申请号：US17966701

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen Ting ,  Pao-Nan Lee ,  Hung-Chun Kuo ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/14

CPC classification number: H05K1/141

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

公开(公告)号：US10186779B2

公开(公告)日：2019-01-22

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Chen-Chao Wang ,  Chun-Yen Ting ,  Ming-Fong Jhong ,  Po-Chih Pan

IPC: H01L23/34 ,  H01Q9/04 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28 ,  H01L23/00

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.