公开(公告)号：US11450596B2

公开(公告)日：2022-09-20

申请号：US16693193

申请日：2019-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Cheng Hsu ,  Chih-Hung Hsu ,  Mei-Lin Hsieh ,  Yuan-Chun Chen ,  Yu-Shun Hsieh ,  Ko-Pu Wu ,  Chin Li Huang

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

公开(公告)号：US11139225B2

公开(公告)日：2021-10-05

申请号：US16442286

申请日：2019-06-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuang-Hsiung Chen ,  Chih-Hung Hsu ,  Mei-Lin Hsieh ,  Yi-Cheng Hsu ,  Yuan-Chun Chen ,  Yu-Shun Hsieh ,  Ko-Pu Wu

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/498

Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.