公开(公告)号：US20210225781A1

公开(公告)日：2021-07-22

申请号：US16748559

申请日：2020-01-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fan-Yu MIN ,  Chen-Hung LEE ,  Hsiu-Chi LIU ,  Liang-Chun CHEN

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: Present disclosure provides a semiconductor package structure, which includes a redistribution layer (RDL) structure, an electronic device, a first reinforcement structure, a second reinforcement structure, and an encapsulant. The RDL structure has a passivation layer and a patterned conductive layer disposed in the passivation layer. The electronic device is disposed on the RDL structure. The first reinforcement structure is disposed on the RDL structure and has a first modulus. The second reinforcement structure is disposed on the first reinforcement structure and has a second modulus substantially less than the first modulus. The encapsulant is disposed on the RDL structure and encapsulates the electronic device, the first reinforcement structure and the second reinforcement structure.

公开(公告)号：US20180301361A1

公开(公告)日：2018-10-18

申请号：US15490817

申请日：2017-04-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fan-Yu MIN ,  Chao-Hung WENG ,  Liang-Chun CHEN

IPC: H01L21/67 ,  B29C70/88 ,  B29C70/68 ,  H01L21/56

Abstract: An apparatus for packaging a semiconductor device is provided. The apparatus includes a first mold, a second mold and a support element. The first mold includes a plate. The second mold includes a carrier disposed corresponding to the plate. The carrier defines a hole penetrating the carrier. The support element is engaged with the hole for supporting an object to be molded.