公开(公告)号：US20210125945A1

公开(公告)日：2021-04-29

申请号：US16663079

申请日：2019-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei CHEN ,  Guo-Cheng LIAO

IPC: H01L23/66 ,  H01L21/3105 ,  H01Q1/22

Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.

公开(公告)号：US20220140467A1

公开(公告)日：2022-05-05

申请号：US17084487

申请日：2020-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei CHEN ,  Hung-Hsiang CHENG ,  Guo-Cheng LIAO ,  Yun-Hsiang TIEN

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/36 ,  H01L23/538 ,  H01Q19/10

Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.