公开(公告)号：US20210125945A1

公开(公告)日：2021-04-29

申请号：US16663079

申请日：2019-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei CHEN ,  Guo-Cheng LIAO

IPC: H01L23/66 ,  H01L21/3105 ,  H01Q1/22

Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.

公开(公告)号：US20190244907A1

公开(公告)日：2019-08-08

申请号：US15889004

申请日：2018-02-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Guo-Cheng LIAO ,  Chia Ching CHEN ,  Yi Chuan DING

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.

公开(公告)号：US20210225742A1

公开(公告)日：2021-07-22

申请号：US16749586

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jyun-Chi JHAN ,  Guo-Cheng LIAO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.

公开(公告)号：US20140367837A1

公开(公告)日：2014-12-18

申请号：US14303371

申请日：2014-06-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Che LEE ,  Yuan-Chang SU ,  Wen-Chi CHENG ,  Guo-Cheng LIAO ,  Yi-Chuan DING

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/11019 ,  H01L2224/11622 ,  H01L2224/1163 ,  H01L2224/13147 ,  H01L2224/14104 ,  H01L2224/16225 ,  H01L2924/12042 ,  H05K3/108 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/09045 ,  H05K2201/10674 ,  H05K2203/0723 ,  H05K2203/1461 ,  H01L2924/00

Abstract: The present disclosure relates to a semiconductor substrate and a method for making the same. The semiconductor substrate includes an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias and a plurality of bumps. The first circuit layer is embedded in a first surface of the insulation layer, and exposed from the first surface of the insulation layer. The second circuit layer is located on a second surface of the insulation layer and electrically connected to the first circuit layer through the conductive vias. The bumps are directly located on part of the first circuit layer, where the lattice of the bumps is the same as that of the first circuit layer.

Abstract translation: 本公开涉及一种半导体衬底及其制造方法。 半导体衬底包括绝缘层，第一电路层，第二电路层，多个导电通孔和多个凸块。 第一电路层嵌入绝缘层的第一表面，并从绝缘层的第一表面露出。 第二电路层位于绝缘层的第二表面上，并通过导电通孔与第一电路层电连接。 凸块直接位于第一电路层的一部分上，其中凸块的晶格与第一电路层的晶格相同。

公开(公告)号：US20230402738A1

公开(公告)日：2023-12-14

申请号：US18231771

申请日：2023-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Guo-Cheng LIAO ,  Yi Chuan DING

IPC: H01Q1/22 ,  H01L23/66 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L21/4853 ,  H01Q1/38 ,  H01L23/49816 ,  H01L21/48 ,  H01Q1/22 ,  H01L23/498 ,  H01L2223/6677

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.

公开(公告)号：US20220140467A1

公开(公告)日：2022-05-05

申请号：US17084487

申请日：2020-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei CHEN ,  Hung-Hsiang CHENG ,  Guo-Cheng LIAO ,  Yun-Hsiang TIEN

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/36 ,  H01L23/538 ,  H01Q19/10

Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.

公开(公告)号：US20210226317A1

公开(公告)日：2021-07-22

申请号：US17222875

申请日：2021-04-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Guo-Cheng LIAO ,  Yi Chuan DING

IPC: H01Q1/22 ,  H01L23/66 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/498

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed

公开(公告)号：US20210225741A1

公开(公告)日：2021-07-22

申请号：US16749793

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Jen CHEN ,  Guo-Cheng LIAO ,  Jyun-Chi JHAN ,  Hui-Chen HSU

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.

公开(公告)号：US20210202410A1

公开(公告)日：2021-07-01

申请号：US16732163

申请日：2019-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Guo-Cheng LIAO ,  Yi Chuan DING

IPC: H01L23/66 ,  H01L23/528 ,  H01L23/00

Abstract: A semiconductor device package includes a first surface and a second surface opposite to the first surface. The semiconductor device package further includes a first supporting structure disposed on the first surface of the substrate and a second supporting structure disposed on the first surface of the substrate. The first supporting structure has a first surface spaced apart from the first surface of the substrate by a first distance. The second supporting structure has a first surface spaced apart from the first surface of the substrate by a second distance. The second distance is different from the first distance. The semiconductor device package further includes a first antenna disposed above the first surface of the substrate. The first antenna is supported by the first surface of the first supporting structure and the first surface of the second supporting structure.

公开(公告)号：US20160336287A1

公开(公告)日：2016-11-17

申请号：US15222873

申请日：2016-07-28

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Guo-Cheng LIAO ,  Chia-Ching CHEN ,  Yi-Chuan DING

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/08238 ,  H01L2224/10175 ,  H01L2224/11436 ,  H01L2224/11462 ,  H01L2224/1161 ,  H01L2224/13008 ,  H01L2224/13021 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13647 ,  H01L2224/16012 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16235 ,  H01L2224/16503 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/3841 ,  H05K3/007 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.

Abstract translation: 半导体封装结构包括衬底，半导体芯片和焊料材料。 基板包括绝缘层，导电电路层和导电凸块。 导电电路层从绝缘层的顶表面凹入。 导电电路层包括焊盘，焊盘的侧表面沿绝缘层的侧表面延伸。 导电凸块设置在垫上。 导电凸块的侧表面，焊盘的顶表面和绝缘层的侧表面一起限定了容纳空间。 焊料材料电连接导电凸块和半导体芯片。 焊接材料的一部分设置在容纳空间中。