公开(公告)号：US20240112978A1

公开(公告)日：2024-04-04

申请号：US17956682

申请日：2022-09-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Vikas GUPTA ,  Mark GERBER

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/3735 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/32225

Abstract: An electronic package is provided. The electronic package includes an insulating carrier, a first conductive layer, and an electronic component. The first conductive layer is disposed over the insulating carrier. The electronic component is disposed over the first conductive layer and electrically connected to the first conductive layer, wherein the insulating carrier is configured to dissipate heat from the electronic component to a second side of the insulating carrier opposite to a first side facing the electronic component.