公开(公告)号：US20240413115A1

公开(公告)日：2024-12-12

申请号：US18207090

申请日：2023-06-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ling YEH ,  Yuan-Feng CHIANG ,  Chung-Hung LAI ,  Chin-Li KAO

IPC: H01L23/00 ,  H01L23/31

Abstract: A package structure is provided. The package structure includes an electronic component, an encapsulant, a first conductive pillar, a first dielectric layer. The electronic component has an active surface. The encapsulant encapsulates the electronic component and exposes the active surface of the electronic component. The first conductive pillar is over the active surface of the electronic component, wherein an upper surface of the first conductive pillar includes a concave portion. The first dielectric layer is over the encapsulant and the active surface of the electronic component, wherein the first dielectric layer defines an opening exposing the concave portion of the first conductive pillar.