公开(公告)号：US12100686B2

公开(公告)日：2024-09-24

申请号：US17086184

申请日：2020-10-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yun Di Hong

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/76 ,  H01L21/6838 ,  H01L24/96 ,  H01L2224/76744 ,  H01L2924/3511

Abstract: A method for manufacturing a semiconductor package structure and a semiconductor manufacturing apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; and (b) sucking the package body through the chuck to create a plurality of negative pressures on a bottom surface of the package body sequentially from an inner portion to an outer portion of the package body.

公开(公告)号：US12176240B2

公开(公告)日：2024-12-24

申请号：US17086187

申请日：2020-10-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yun Di Hong

IPC: H01L21/687 ,  H01L21/304 ,  H01L21/67 ,  H01L21/683

Abstract: A method for manufacturing a semiconductor package structure and a clamp apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; (b) moving a pressing tool transversely to above the package body; and (c) pressing the package body on the chuck through the pressing tool.